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Free download vista crack. Buy vista ultimate. vista ultimate crack keygen.1. Field of the Invention
The present invention relates to an apparatus for measuring the surface shape of a semiconductor wafer and a method for processing a semiconductor wafer using the same. More particularly, the present invention relates to an apparatus for measuring the surface shape of a semiconductor wafer using a white-light interferometer by projecting a Gaussian beam having a uniform intensity distribution to the wafer surface, and a method for processing a semiconductor wafer using the same.
2. Description of the Related Art
Currently, when a semiconductor wafer is manufactured, a surface roughness (or a surface defect) of the wafer is measured by using a white-light interferometer, whereby the wafer quality is checked. For example, Japanese Patent No. 4290590 discloses a method for measuring a surface roughness of a silicon semiconductor wafer that is obtained by mounting the wafer on a stage and scanning the stage using a stage that is driven by a linear motor.
In this method, as shown in FIG. 7, a laser beam 62 is projected onto a wafer 61, and a white-light interferometer 63 for surface shape measurement is used to measure a surface shape of the wafer 61. In this case, the projection amount of the laser beam 62 is determined in such a manner that the obtained surface shape of the wafer 61 approximates a surface shape of a reference plate 64 (i.
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